PROCESS APPLICATIONS AND TEMPERATURE PROFILES
Efficient design and customization capabilities have enabled our furnaces to be applied in a wide range of processes such as firing, brazing, annealing, sintering, hardening, glass to metal seal, reflow soldering, epoxy curing, hermetic sealing, LTCC (Low Temperature
Co-fired Ceramics ), etc.
After a paste is screened onto a substrate and it settles for 5-15 minutes at room temperature, it undergoes oven drying at 100-150ˇăC for 10-15 minutes to remove solvents. Firing is then completed in conveyor belt furnaces at temperatures between 500-1000ˇăC.
Typical Temperature Profile:
HSG Series Thick Film Drying Furnace
HSK Series Thick Film Firing Furnace