HSF SERIES CONVECTION REFLOW FURNACE
Features
- Rated to 400°C, the HSF Series convection reflow belt furnace features an ultra-clean rapid response heating chamber.
- Precise temperature controls
- Uniform temperature distribution
- Air or Nitrogen Atmosphere
- Infra-red and/or hot air circulation heating
Applications
HSF series belt furnace is widely used in the following applications:
- SMD/SMT - surface mount device reflow soldering.
- PMC - post molding curing.
- Chip joing and die bonding.
- Epoxy curing, underfill curing,
- Encapsulation, etc.
Model |
Heat Zones |
Belt Width |
Overall Length |
HSF2605-0304 |
3 |
260mm |
2445mm |
HSF3505-0504 |
5 |
350mm |
3260mm |
HSF5605-0704 |
7 |
560mm |
4075mm |
HSF6305-1004 |
10 |
635mm |
8535mm |
Options and Customizations
Available Options and Customizations |
Ultrasonic Belt Cleaning/Drying |
Computer Control System |
UPS |
Customizable heating and cooling length |
Our dedicated engineers will always take the extra step to work with clients for customized designs.